JL Chip currently mainly involves eight major fields (headphone chip, speaker chi, smart watch chip, video chip, health chip, IoT chip, smart toy chip, and smart travel chip), with more than 2,000 types of chip. , especially in the field of Bluetooth audio decoding, it has great advantages. The market share of Bluetooth small speakers and wireless headsets currently exceeds 40%. At the same time, due to the large number of chip resources, in addition to Bluetooth radio frequency functions, it can control IO and other peripherals to implement MCU Function control can greatly simplify product solution design and reduce hardware solution costs.
In the process of solution development, many friends select board models based on the silk screen printing of peers. Many friends select product functions. Many problems often occur during the product implementation process, such as chip not being produced frequently and the chip ordering cycle is slow. For example, the product performance is low and cannot meet the product demand, or it is discovered that a cheaper chip can be substituted after the product is developed, or the chip is already an older model and has no advantages from the perspective of price, resources and stocking. Therefore, this article mainly focuses on the above issues and sorts out the ideas and precautions for selection from a technical perspective. The specific selection is considered from the following perspectives:
1. Product form
First, determine the product form. Common forms are classified as follows:
1.1 Bluetooth headsets
Specifically, they include TWS, OWS, hanging neck sports headphones, and over-ear headphones. Different headphone forms have different focuses and involve different chips.
1.2 Bluetooth speakers
Specifically, they include small Bluetooth speakers, large Sound Blaster speakers, smart speakers, and Bluetooth karaoke speakers that have become increasingly popular in recent years.
1.3 Audio decoding class
Specifically include: voice announcer, sound-making toys, etc. If MP3 decoding player products have higher audio quality requirements, you can choose AC6082A or AD16N. Sound-making toys have lower sound quality requirements, usually AD14N, AD15N, AD17N.
1.4 IOT Internet of Things
The application scenarios of IoT are relatively scattered and the product forms are also very rich. If you are connecting APPs to smart home products that use Bluetooth, you can choose the AC632N series of chip. This series of chips is mainly used for Bluetooth BLE data transmission. Customers can choose the chip according to the specific user scenario. For example, if it is only used for data transmission, choose 8 An AC6328A with three pins is enough.
2. Functional requirements
Once the product form is determined, the specific functional requirements of the project need to be further refined.
2.1 Bluetooth speakers:
For example, whether it supports AUX, U disk, TF card, LED, digital tube, LCD screen, etc. In addition, a certain number of IO may be needed for some control and response. Usually, the number of chip pins needs to be determined based on these.
2.2 Bluetooth headsets:
It is necessary to consider the headphone pairing method, user operation interaction method, whether it needs to support ENC, ANC and other noise reduction, whether it supports single feed or mixed feed, etc.
The AC700N series such as AC7003/AC7006 are the most demanding headphones on the market. The choice of most customers in the world, the price is half of JL701N and it also has noise reduction function.
The JL701N series is a headphone speaker chip with algorithms and more powerful ENC and ANC. It is usually a relatively high-end headphone or smart speaker chip. Such as in-ear, assistive listening, noise reduction, low latency, one-to-many application scenarios. JL7016C8 and JL7016G8 can be used as microphone solutions, JL7018F8 and JL7018G8 can be used as gaming headsets, etc.
3. Performance requirements
3.1 Sound quality and sound effects
When it comes to audio products such as Bluetooth speakers and headphones, this is a key consideration or even the first factor. The quality of the chip sound source output will have a great impact on the final sound effect of the product. Specifically, you need to pay attention to: Bluetooth decoding format ( SBC/AAC / LDAC / LHDC ), DAC capabilities (including decoding capabilities, SNR parameters), and chip noise floor. Parameters, especially some mid-to-high-end products, such as supporting Hi-Res lossless decoding format such as LDAC / LHDC will make the product very eye-catching.
3.2 Processing capability
Including CPU speed and RAM size. In particular, some projects that require third-party algorithms may be more concerned about this. The following is the RAM situation of Jerry series chip:
3.3 Storage capacity
JL chip usually have internal Flash inside. In addition to storing chip programs, it can also be used to store prompts, customized audio content, etc. Common capacities of Flash that come with Jerry chips include: 4Mb, 8Mb, 16Mb, 32Mb, etc. (Note: The unit here is bit. If you need to convert it into bytes, divide it by 8.) If the built-in storage capacity is not enough, you can also consider using an external Flash.
3.4 Power consumption
Power consumption will directly affect the working time of the product, including startup state, sleep state, and sometimes the running of the code also affects power consumption. This is within the scope that developers need to consider (it is recommended that companies collect the power consumption of each series). Power consumption is usually not written in the specifications, so an ammeter is required to test the power consumption.
3.5 Bluetooth version
If it involves Bluetooth products, you need to determine the chip Bluetooth version.
It should be noted that the wafers of each series of JL chip are the same, and the same wafer means that the chip performance is the same. For example, the AC695X series of chip, AC6951C (LQFP48 package) and AC6955F, have the main chip. The frequency and RAM are the same, and the sound quality performance is the same. Therefore, in this case, you only need to consider whether the chip pin function locks the number of IO ports and whether the performance is required by the project.
4. Cost
For the same wafer series, if it can meet the product functions, generally speaking, the fewer the pins, the lower the chip price will be (but this is not absolute. If a certain model is sold by an agent in large quantities, it may be available on this model. cost advantage).
Cost is a relatively large consideration for customers in the current market, but they cannot blindly pursue cost. For example, if some chips are low in cost but not well stocked by the original factory, it will definitely affect production and delivery. First, continuous supply capacity and continuous supply need to be considered. chip batches.
5. Supply stability
5.1 Life cycle
There is a certain time period between the launch of a specific chip and its withdrawal from the market. When selecting chips, it is best to consider choosing products that are in the prime of life. Try to choose chip models that have been batched to prevent problems caused by non-core material numbers. The cycle of consumer electronics is short and the product iteration speed is relatively fast. The latest series can be communicated with our company at any time.
5.2 Material number versatility
For general or commonly used material numbers, the original factory stock is relatively sufficient. There are minimum production requirements for the original factory to produce a material number, just like tofu, it needs to be cut into whole pieces. Some customers must make a stocking plan in advance if they select a very commonly used material number.
6. Packaging
Chip packaging affects space, sample and production convenience. For example, for some products that require structural space, such as TWS headsets, try to choose QFN chips that take up less space. However, on the other hand, QFN chips are not as convenient as SSOP packaging in the process of engineering and welding sample production. QFN is also commonly used. Tape packaging, for batch patch production, the patch efficiency will be much faster. Of course, QFN’s requirements for patch machines are definitely higher than SSOP. Commonly used packages in Jerry include: SOP8, SOP16, SSOP24, QFN20, QFN32, QFN40 , LQFP48, can be selected according to the actual situation of your company.
7. Others
7.1 Reliability and stability
Because the chip is mainly positioned in the consumer and IOT markets, it needs to be carefully . You need to check the working temperature and humidity parameters of the chip .
7.2 Process
The higher the chip manufacturing process, the lower the performance and power consumption. jl found that the manufacturing process of mainstream chips has been upgraded to 40nm and 28nm.
Summary : As a core component in electronic products, jl chip are constantly being updated and iterated, and new ones are constantly being released in response to market demand. As JL first-level agent, our company has always maintained close contact and communication with the original factory. If you have anything you don’t understand, please contact us at any time.
